MicroCraft

  • Moving Probe Tester

Special Moving Probes Conduct High Speed / High Accuracy Testing
to Detect Faults on both sides of the Board

Measurement System

Phase Difference Measurement (PDM)

Phase Difference Measurement (PDM)
MicroCraft's independently developed testing method which exponentially speeds up both continuity/isolation tests. This method is most suitable for medium size production quantity.

Phase Difference Measurement (PDM) Unit
Phase Difference Measurement Unit (PDM) sends high frequency signal between the reference line (plane) and signal line to measure differences between these phases, which will cut down unnecessary isolation tests within the net. With fewer test points and test cycle compared to ordinary isolation test, the test speed have increased dramatically.

HVS (High Voltage Stress Test)

HVS (High Voltage Stress Test) is a measurement system that is capable of detecting high resistance isolation defect which was undetectable with Phase Difference Measurement (PDM). HVS is conducted by applying high voltage pulses between signal lines to detect high resistance defect. HVS similar to PDM, inspects each net once, thus achieves much faster test speed compared to ordinary isolation test by resistance measurement. This revolutionary testing method can be upgraded as an option to our EMMA series. Optional

High Voltage Isolation Resistance Measurement Unit

As to maximum applicable voltage with standard isolation resistance measurement is 250 V,
this offers the option of applying maximum of 500 V / 1000 V for highly reliable high resistance isolation test. Optional

Super High Resistance Isolation Measurement Unit

Test Voltage Test range

10 V

200 V

Max. 10 GΩ

Max. 100 GΩ

This is an option to detect super high resistance isolation defect by applying lower test voltage. The usage of low voltage allows users to conduct super high resistance test without adding high stress on the tested boards. Optional

* Applicable for E4 and F2 models in our EMMA lineup.

Micro Short Detection

Sudden application of high voltage in isolation test may result in burning out of parts containing Micro Short.
This is caused by carbonized residue possibly reacting with moisture in the air or gases in the factory,
which causes the element to relapse as high resistance short error after the test is complete.
Our Micro-short test avoids such damage and trouble by applying a low voltage (less than 30V)
before gradually increasing the applying voltage.
Again, high resistance short between multiple layers of a board may possess the characteristics of semiconductor and capacitors.
These errors can also be detected in our test by reversing the polarity of high voltage.

Connection with External Meter

By connecting to external meter using GPIB interface or USB connection,
it is possible to work with super high resistance isolation measurement,
super high voltage measurement, and even detecting layer-short in LCR, diode, and coil pattern. Optional

List of External meter currently supported
Keysight Technologies

34410A Digital Multimeter (USB)
3458A Digital Multimeter (GPIB)
B2985A Electro Meter (USB)
34420A Micro-Ohm Meter (GPIB)
4339B High Resistance Meter (GPIB)
E4980A LCR Meter (USB)
4284A LCR Meter (GPIB)
4285A LCR Meter (GPIB)

Keithley Instruments Inc.

6487 Picoammeter (GPIB)

Kelvin Probe

Precision Resistance Measurement Unit
A 4 wire, 4 points measurement method by Kelvin probe allows high accuracy testing by low resistance. Furthermore, measuring Buried Resistance and saving the measured values are also included. Optional

Min. Resolution: 0.001 mΩ
Also can check probe contact error

RangeResolutionMeasurable rangeCurrentApplication
0–4 mΩ0.001 mΩ0.4 mΩ–3 mΩ150 mAKelvin Probe
0–40 mΩ0.01 mΩ2 mΩ–30 mΩ125 mAKelvin Probe
0–400 mΩ0.1 mΩ30 mΩ–300 mΩ125 mAKelvin Probe
0–4 Ω1 mΩ0.3 Ω–3 Ω125 mAKelvin Probe
0–10 Ω2.5 mΩ0.5 Ω–8 Ω10 mA
0–100 Ω25 mΩ5 Ω–80 Ω10 mA
0–1000 Ω250 mΩ50 Ω–800 Ω2.5 mA
0–10 kΩ2.5 Ω500 Ω–8 kΩ0.25 mA
0–100 kΩ25 Ω5 kΩ–80 kΩ25 µABuried Resistance
0–1 MΩ250 Ω50 kΩ–800 kΩ 2.5 µABuried Resistance

Contact Check in Isolation Test
In order to improve isolation test accuracy, this feature enables users to verify probes are correctly in contact with the pad prior to testing. This contact check function effectively assist the user during pad search.

LATENT Test

Latent test is the highest fault detection technology. Latent not only detects the existing defects, but also is capable of finding dormant ones having the possibility of becoming a permanent defect in the near future. This testing method enhances the product reliability. Optional

The pattern with “latent” or dormant defect, when applied with high current will induce temperature rise causing the output resistance to become nonlinear. This change shall be detected at high speed and accuracy and thus detect Latent defect.

Specifications ANALOG LF ANALOG HF DIGITAL
Drive frequency

1 kHz

1.46 MHz + 1.10 MHz

5 k–40 kHz Variable

Drive voltage (Max.)

15 V

5 V

0–30 V Variable

Drive current (Max.)

1.5 A

500 mA

0–1.5 A Variable

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